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Startseite ProduktePWB-PrototypenF4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF
F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF
F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF
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F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF

Markenname: Wangling Modellnummer: F4BTMS233

Produkt-Beschreibung

When an aerospace RF design demands both low dielectric constant and ultra-thin construction, material options narrow quickly. The F4BTMS233 from Taizhou Wangling Insulation Materials Factory addresses this niche directly: an aerospace-grade, ceramic-filled PTFE laminate with a Dk of 2.33, available in dielectric thicknesses as thin as 0.09mm (3.5 mil), and engineered to replace comparable foreign products. The F4BTMS series is an upgraded version of the F4BTM series,

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