Fabricated with RF-30A laminate Dk 3.0 2-Layer High-Frequency PCB – 20mil (0.6mm) with ENIG Finish

2-Layer RF-30A High-Frequency PCB – 20mil (0.6mm) with ENIG Finish

Product Introduction

We present our 2-Layer RF-30A PCB – a high-performance, thin-profile circuit board engineered for demanding RF and microwave applications. Fabricated with RF-30A laminate (Dk 3.0, Df 0.003 @ 10 GHz) and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.6mm (20mil) board delivers excellent signal integrity, low insertion loss, and superior environmental stability. The thin dielectric profile minimizes parasitic effects, making it ideal for compact, high-frequency wireless and radar systems.

Key Specifications

PCB Stackup (2-Layer Rigid)

Note: No blind vias – all interconnections are through-hole, simplifying fabrication and reducing cost.

PCB Statistics

Dimensions: 85.6 mm × 99.8 mm (1 piece)

Components: 54

Total Pads: 43 (19 thru-hole, 24 SMT on top, 0 on bottom)

Vias: 36

Nets: 2 (Simple, high-speed RF signal paths)

Why RF-30A?

RF-30A is a next-generation RF laminate featuring an advanced resin system and optimized glass fabric reinforcement. Unlike conventional PTFE-based materials, RF-30A processes like standard FR4 – no special handling required – while delivering exceptional high-frequency performance. With a Tg >180°C, it fully supports 260°C lead-free assembly and offers outstanding thermal and chemical resistance for harsh operating environments.

Key Features of RF-30A

Benefits of This 20mil RF-30A PCB

Ultra-Low Loss: Df of 0.003 at 10 GHz minimizes signal attenuation for long RF traces.

Stable Dk: Consistent dielectric constant across frequency and temperature ensures predictable impedance control.

Thin Profile (20mil): Reduces parasitic capacitance and inductance, ideal for compact RF modules and portable devices.

Lead-Free Assembly Ready: Withstands 260°C reflow (T260 >90 min, T288 >30 min).

CTE Matched to Copper: X/Y CTE (9–13 ppm/°C) closely matches copper, reducing stress on plated vias and improving solder joint reliability.

ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top SMT pads).

Process-Friendly: No PTFE-specific handling – compatible with standard FR4 fabrication lines, reducing lead times and cost.

Reliable in Harsh Environments: Ultra-low moisture absorption (0.08%) and excellent CAF/chemical resistance ensure long-term field performance.

Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance (artwork supplied)

ISO 9001 certified production

Typical Applications

RF/Microwave Communication Devices

5G/6G Base Stations & Antennas

Radar Systems (automotive, defense, weather)

Satellite Communication Equipment

RF Power Amplifiers & Transceivers

Aerospace & Defense Electronics

High-Frequency Test Instruments

Automotive RF Components (V2X, radar, telematics)

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for lead times, impedance control reports, and volume pricing.