low DK 2.55 F4BME255 PTFE glass fabric reinforced Copper Clad Laminate F4BME paired with reverse-treated (RTF) copper foil

F4BME255 Copper Clad Laminate: Low-PIM PTFE Composite for High-Frequency Applications

Taizhou Wangling Insulating Materials Factory presents the F4BME255, a high-performance PTFE glass fabric reinforced copper clad laminate engineered for applications demanding exceptional passive intermodulation (PIM) performance. As part of our F4BME series, this material combines stable electrical properties with advanced reverse treated copper foil technology to deliver superior signal integrity for RF and microwave designs.

Electrical Performance with Low-PIM Technology
The F4BME255 features a dielectric constant (Dk) of 2.55 ±0.05 at 10 GHz, providing stable and predictable electrical performance critical for controlled impedance designs. The dissipation factor (Df) is exceptionally low:

0.0013 at 10 GHz

0.0018 at 20 GHz

F4BME series

What truly distinguishes the F4BME255 is its outstanding PIM performance. With a PIM value of ≤ -159 dBc, this material is specifically optimized for applications where passive intermodulation distortion cannot be tolerated.

The reverse treated copper foil (RTF) technology delivers:

Superior PIM characteristics for high-sensitivity receiver systems

More precise circuit line control through reduced copper surface roughness

Lower conductor loss compared to standard electrodeposited copper

The thermal coefficient of dielectric constant is -110 ppm/°C from -55°C to 150°C, ensuring stable electrical performance across a wide operating temperature range. Volume resistivity exceeds 6 × 10⁶ MΩ·cm, while surface resistivity is ≥1 × 10⁶ MΩ, providing robust insulation characteristics.

Thermal Performance:

Coefficient of Thermal Expansion (CTE): 16-21 ppm/°C (X/Y direction), 173 ppm/°C (Z direction)

Thermal Conductivity: 0.33 W/(m·K)—enhanced heat dissipation for power applications

Long-Term Operating Temperature: -55°C to +260°C

Thermal Stress: Withstands 260°C for 10 seconds over three cycles without delamination

Mechanical Excellence:

Copper Peel Strength: >1.6 N/mm with 1 oz RTF copper

Moisture Absorption: ≤0.08%, ensuring consistent performance in humid environments

Density: 2.25 g/cm³

Flammability Rating: UL 94 V-0

Versatile Applications

Microwave and RF circuits

Radar systems

Phase shifters and passive components

Power dividers, couplers, and combiners

Feed networks and phased array antennas

Satellite communications and base station antennas

Processing and Fabrication
The F4BME255 is designed for manufacturability using standard PTFE fabrication techniques:

Compatible with conventional PCB processing equipment

Excellent machinability for drilling, routing, and shearing

Resistant to all common etching chemicals and solvents

Supports both through-hole and surface-mount technologies

Excellent dimensional stability throughout fabrication

The RTF copper foil features a specially treated surface that provides superior adhesion while maintaining the smooth signal-carrying surface essential for low-loss performance.

Standard Configurations
Copper Foil Options (F4BME Series):

0.5 oz (0.018mm) reverse treated copper foil

1 oz (0.035mm) reverse treated copper foil

Standard Panel Sizes:

460 × 610mm (18" × 24")

500 × 600mm

850 × 1200mm

914 × 1220mm (36" × 48")

1000 × 1200mm

Custom Sizes Available:

300 × 250mm, 350 × 380mm, 500 × 500mm, 840 × 840mm, 1000 × 1500mm

Thickness Options:

Available from 0.1mm to 12.0mm (specify whether total thickness or dielectric thickness)

For Dk ≤ 2.65, minimum dielectric thickness: 0.1mm

For Dk 2.7–3.0, minimum dielectric thickness: 0.2mm

Metal-Backed Configurations:

F4BME255-AL: Aluminum-backed for lightweight thermal management

F4BME255-CU: Copper-backed for maximum heat dissipation

Production Capabilities and Quality Assurance

As a specialized manufacturer of PTFE-based circuit materials, Taizhou Wangling maintains rigorous quality control throughout the production process:

Advanced Manufacturing: Precision resin impregnation, high-temperature lamination, and strict process control

Production Capacity: Scalable manufacturing to support both prototype and high-volume requirements

Quality Testing: All materials tested in accordance with IPC-TM-650 and GB/T standards

Lot Traceability: Complete material traceability for quality assurance

Storage Requirements:

Store in clean, dry environment at 10°C to 35°C

Maintain relative humidity below 70%

Keep in original packaging until ready for use

Avoid direct sunlight, corrosive gases, and extreme temperature fluctuations

Store panels flat to prevent warpage

Recommended shelf life: 12 months under proper conditions

Transportation:

Protective interleaving prevents surface damage

Secure edge protection minimizes transit damage

Moisture-barrier packaging for humidity protection

Multiple packaging options for domestic and international shipping

Compliant with international electronic material shipping regulations

Why Choose F4BME255?
The F4BME255 combines stable electrical properties, ultra-low PIM performance, and excellent thermal characteristics in a cost-effective, high-volume manufacturable platform. Its RTF copper technology delivers superior signal integrity while maintaining strong adhesion, making it an ideal choice for designers seeking reliable, high-performance materials for demanding RF applications.

Contact Taizhou Wangling Insulating Materials Factory today to discuss how F4BME255 can meet your specific high-frequency design requirements.