AD250C low DK2.52 Copper Clad Laminate substrate thick 20mil, 30mil, 60mil manufacture RF microwave PCB

AD250C Copper Clad Laminate: Engineered for High-Performance Antenna Applications

Rogers Corporation introduces the AD250C, a premium glass-reinforced PTFE-based laminate specifically engineered to meet the demanding requirements of today's wireless antenna markets. As part of the AD Series™ antenna materials, the AD250C delivers controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) characteristics—making it an ideal choice for a wide range of antenna applications.

Electrical Performance
The AD250C features a process dielectric constant (Dk) of 2.52 at 10 GHz with a design Dk of 2.50, providing exceptional consistency and tight control that enables precise impedance matching and repeatable circuit performance. The dissipation factor (Df) is an impressively low 0.0013 at 10 GHz, ensuring minimal signal loss and high efficiency in power-sensitive applications.

Key electrical properties include:

• Thermal Coefficient of Dielectric Constant: -117 ppm/°C, ensuring stable performance across temperature variations
• Volume Resistivity: 4.8 × 10⁸ MΩ-cm
• Surface Resistivity: 4.1 × 10⁷ MΩ
• Electrical Strength: 979 V/mil
• Dielectric Breakdown: >40 kV in X/Y direction

PIM Performance
The AD250C delivers exceptional passive intermodulation performance with typical PIM values of -159 to -163 dBc (tested with S1 foil at 1900 MHz). This ultra-low PIM characteristic makes the AD250C particularly well-suited for sensitive antenna systems where distortion cannot be tolerated.

Thermal Properties:

• Decomposition Temperature (Td): >500°C
• Coefficient of Thermal Expansion (CTE): 47 ppm/°C (X-axis), 29 ppm/°C (Y-axis), 196 ppm/°C (Z-axis)
• Thermal Conductivity: 0.33 W/(m·K)
• Time to Delamination: >60 minutes at 288°C

Mechanical Properties:

• Copper Peel Strength: 2.6 N/mm (14.8 lbs/in) with 1 oz copper
• Flexural Strength: 60.7/44.1 MPa (8.8/6.4 ksi) MD/CMD
• Tensile Strength: 41.4/38.6 MPa (6.0/5.6 ksi) MD/CMD
• Dimensional Stability: 0.02/0.06 mils/inch (MD/CMD) after etch and bake

Physical Characteristics

• Moisture Absorption: 0.04%, ensuring stable performance in humid environments
• Density: 2.28 g/cm³
• Specific Heat Capacity: 0.813 J/g·K
• Flammability Rating: UL 94 V-0

Applications

Base station antennas

Phased array antennas

Passive components (couplers, dividers, filters)

RF identification (RFID) systems

Satellite communication antennas

Automotive antenna systems

Processing and Fabrication
As a woven glass-reinforced PTFE material, the AD250C offers excellent circuit processability and enables high-yield circuit board fabrication. The material can be processed using standard PTFE fabrication techniques:

1. Compatible with mechanical drilling and routing
2. Supports plated through-hole processing
3. Can be etched using standard chemical solutions
4. Excellent dimensional stability during fabrication
5. Available with both standard electrodeposited (ED) and reverse treated ED copper foil options

Copper Foil Options
The AD250C is offered with multiple copper foil options to suit specific application requirements:

Electrodeposited (ED) Copper: ½ oz. (18μm) and 1 oz. (35μm)

Reverse Treated ED Copper: ½ oz. (18μm) and 1 oz. (35μm) — provides improved PIM performance

Standard Thicknesses:

0.020" (0.508 mm) ±0.002"

0.030" (0.762 mm) ±0.002"

0.060" (1.524 mm) ±0.003"

Standard Panel Sizes:

18" × 12" (457mm × 305mm)

18" × 24" (457mm × 610mm)

Custom thicknesses, panel sizes, and claddings are available upon request—please contact our customer service team for more information.

Production Capabilities and Supply Chain

Production Capacity: High-volume manufacturing with advanced PTFE processing technologies

Quality Assurance: Each shipment includes a Certificate of Compliance with actual test data

Global Footprint: Manufacturing and distribution facilities serving customers worldwide

Customization: Flexible production lines accommodate both prototype and high-volume requirements

Storage and Transportation Guidelines
To maintain the exceptional quality and performance of AD250C laminates, we recommend the following:

Storage Requirements:

Store in a clean, dry environment at 10°C to 35°C

Maintain relative humidity below 70%

Keep in original moisture-resistant packaging until ready for use

Avoid exposure to direct sunlight, corrosive gases, and extreme temperature fluctuations

Store panels flat to prevent warpage

Recommended shelf life: 12 months under proper storage conditions

Transportation:

Laminates are packaged with protective interleaving to prevent surface damage

Secure edge protection minimizes risk of damage during transit

Moisture-barrier packaging protects against humidity

Multiple packaging options available for domestic and international shipping

Full compliance with international shipping regulations for electronic materials

Why Choose AD250C?
The AD250C combines the proven reliability of Rogers' PTFE-based technology with specific optimizations for antenna applications. Its controlled Dk, low loss, excellent PIM performance, and high copper peel strength make it an ideal choice for designers seeking consistent, high-performance materials for wireless infrastructure.

Contact us today to discuss how AD250C can meet your specific antenna design requirements.