F4BTME320 PCB 2-Layer copper and 60mil Core laminates, Immersion Tin Finish using in Satellite communications

2-Layer F4BTME320 PCB: 60mil Core, Immersion Tin Finish, and High-Frequency Performance
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 
 
Overview of the 2-Layer F4BTME320 PCB
The 2-layer F4BTME320 PCB is a high-performance printed circuit board designed for microwave, RF, and aerospace applications. Manufactured using F4BTME320 laminates, this PCB features low loss, high dielectric constant stability, and excellent thermal resistance, making it ideal for radar systems, satellite communications, and phased array antennas.
 
With a 60mil (1.524mm) core thickness, immersion tin surface finish, and black solder mask, the PCB is optimized for high-frequency systems requiring dimensional stability and reliable signal propagation.
 

 
PCB Construction Details

 
 
 
PCB Stackup

 
This stackup ensures consistent electrical properties and minimal conductor loss, critical for RF and microwave designs.
 
 
PCB Statistics

• Components: 31
• Total Pads: 105
• Thru Hole Pads: 71
• Top SMT Pads: 34
• Bottom SMT Pads: 0
• Vias: 28
• Nets: 2

 
 
Introduction to F4BTME320 Material
F4BTME320 is a high-frequency laminate manufactured using a unique combination of PTFE resin, nano-ceramic fillers, and glass fiber cloth. Designed for RF and microwave applications, F4BTME320 offers excellent dielectric stability, low dissipation factor, and high heat resistance.
 
The material’s reverse-treated RTF copper foil provides low PIM, minimal conductor loss, and precise line control, ensuring exceptional performance in high-frequency circuits.
 
Features of F4BTME320

• Dielectric Constant (Dk): 3.2 ± 0.06 at 10GHz
• Dissipation Factor (Df): 0.002 at 10GHz, 0.0026 at 20GHz, Thermal Coefficient of Dk: -75 ppm/°C (-55°C to 150°C)
• Coefficient of Thermal Expansion (CTE): X-axis: 13 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 58 ppm/°C
• Thermal Decomposition Temperature (Td): 503°C
• Thermal Conductivity: 0.8 W/mK
• Moisture Absorption: 0.05%
• PIM Performance: <-160 dBc

 
 
Benefits of F4BTME320 PCB

1. Low Loss for High-Frequency Applications: Minimal dissipation factor ensures superior signal integrity.
2. Thermal Stability: High thermal conductivity and low thermal coefficient of Dk provide reliable performance in extreme environments.
3. Low PIM and Conductor Loss: Ideal for advanced RF and microwave designs.
4. Dimensional Stability: Nano-ceramic fillers and precise manufacturing ensure consistent performance.
5. Cost-Effective Alternative: Combines high-performance properties with affordable manufacturing.

 
Applications of F4BTME320 PCB

1. Aerospace Equipment: Used in space and cabin systems for reliable signal performance.
2. Microwave and RF Systems: Ideal for high-frequency circuit designs.
3. Radar Systems: Supports advanced radar designs, including military radar.
4. Feed Networks and Phased Array Antennas: Ensures precision in beamforming and signal routing.
5. Satellite Communications: Provides consistent electrical performance in satellite systems.
6. Power Amplifiers: Offers low loss with excellent heat dissipation for high-power designs.

 
 
Why Choose the 2-Layer F4BTME320 PCB?
The 2-layer F4BTME320 PCB is a trusted solution for high-frequency and high-reliability applications. Its combination of low loss, thermal stability, and mechanical reliability makes it ideal for critical RF and microwave systems. With features like 60mil core thickness, immersion tin finish, and black solder mask, this PCB ensures long-term performance in demanding environments.
 
Contact us today for more information or to get started on your project with this high-performance PCB!