RT/Duroid 5880 and RO4450F hybrid 4-Layer PCB with 3.0mm Thickness substrates and OSP Finish for Microstrip and Stripline Circuits

4-Layer PCB with RT/Duroid 5880 and RO4450F, 3.0mm Thickness, and OSP Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of the 4-Layer PCB

This 4-layer PCB combines RT/duroid 5880 and RO4450F materials to deliver exceptional performance in high-frequency circuits. The RT/duroid 5880 core provides uniform dielectric constant, low dissipation factor, and excellent moisture resistance, while the RO4450F bonding ply ensures mechanical stability and durability. With a 2.2 dielectric constant (Dk) and low dissipation factor (Df) of 0.0009 at 10 GHz, this PCB ensures outstanding signal integrity.

The OSP finish is ideal for protecting copper surfaces and ensuring solderability during assembly. Designed with blind vias and strict IPC-Class-2 compliance, this PCB is built for reliability and performance in critical applications.

2. PCB Construction Details

3. PCB Stackup

The 4-layer rigid PCB stackup is carefully designed to balance low-loss performance and mechanical durability. Here’s the detailed stackup:

4. Features of RT/Duroid 5880

• Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz/23°C, ensuring stable signal propagation.
• Dissipation Factor (Df): 0.0009 at 10 GHz, minimizing signal loss.
• Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C.
• CTE (Coefficient of Thermal Expansion): X-axis: 31 ppm/°C. Y-axis: 48 ppm/°C. Z-axis: 237 ppm/°C. Ensures dimensional stability and reliable plated-through hole performance.
• Moisture Absorption: 0.02%, ensuring consistent performance in humid environments.
• Isotropic Properties: Ensures uniform electrical and mechanical performance.

5. Benefits of RT/Duroid 5880 Material

Uniform Electrical Properties: Ensures stable performance over a wide range of frequencies.

Low Electrical Loss: Ideal for high-frequency applications, including Ku-band and above.

Dimensional Stability: The glass microfiber reinforcement improves stability and reduces warping.

Moisture Resistance: Maintains performance in humid or marine environments.

Machinability: Easily cut, drilled, or machined, reducing manufacturing complexity.

6. Applications of the 4-Layer PCB

Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter-Wave Applications

Radar and Guidance Systems

Point-to-Point Digital Radio Antennas

Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in manufacturing high-quality PCBs for RF and microwave applications. Our 4-layer PCB with RT/duroid 5880 and RO4450F materials combines advanced materials with precise fabrication to deliver reliable and high-performance solutions for your projects.

Why Work With Us?

Global Reach: We deliver worldwide and provide excellent customer support.

High Standards: All PCBs are tested to IPC-Class-2 standards, ensuring quality and reliability.

Custom Solutions: We work closely with you to meet your specific requirements.

If you’re looking for a trusted partner for your next high-frequency project, feel free to contact me at sales30@bichengpcb.com. Let’s work together to bring your innovative designs to life.