logo
produits
EINZELHEITEN ZU DEN PRODUKTEN
Zu Hause > Produits >
2-Layer TFA615 PCB 0.508mm Thin using PTFE ceramic composite dielectric material, Immersion Gold Finish for Power amplifiers

2-Layer TFA615 PCB 0.508mm Thin using PTFE ceramic composite dielectric material, Immersion Gold Finish for Power amplifiers

MOQ: 1pcs
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000pcs
Ausführliche Information
Herkunftsort
China
Markenname
Ceramic
Zertifizierung
ISO9001
Modellnummer
TFA615
Grundmaterial:
TFA615
Testmethode:
Flying Probe -Test
Kupfergewicht:
0.5-3oz
Kupfer Thinknes:
1 oz
Modell:
XCET
Seidenbildschirm:
Grün, Schwarz, Blau, Gelb, Rot usw.
Schichten:
2
Land:
China
Min -Linienbreite:
5mil
Kupfer Thk:
1oz
Oberflächenhalterung:
Ja
Produkttyp:
Gedruckte Leiterplatte
Min Bestellmenge:
1pcs
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000pcs
Beschreibung des Produkts

2-Layer TFA615 PCB: 0.6mm Thin, Immersion Gold Finish, and Aerospace-Grade High-Frequency Performance
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 
 
Overview of the 2-Layer TFA615 PCB
The 2-layer TFA615 PCB is a high-performance printed circuit board designed for aerospace, microwave, and radar applications. Manufactured using the TFA615 PTFE ceramic composite dielectric material, this PCB exhibits outstanding electrical, thermal, and mechanical properties. With a dielectric constant of 6.15, low dissipation factor, and minimal anisotropy, this material is optimized for high-frequency and high-reliability systems in demanding environments.
 
With a finished thickness of 0.6mm, immersion gold surface finish, and rigid structure, the TFA615 PCB meets IPC-Class-2 standards, making it an ideal solution for mission-critical applications in aerospace and satellite communications.
 
2-Layer TFA615 PCB 0.508mm Thin using PTFE ceramic composite dielectric material, Immersion Gold Finish for Power amplifiers 0
 
PCB Construction Details

Parameter Specification
Base Material TFA615
Layer Count 2 layers
Board Dimensions 206mm x 54mm ± 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

 
 
PCB Stackup
The 2-layer TFA615 PCB stackup is engineered for superior RF and microwave performance, utilizing TFA615 material for its low dielectric loss and stable frequency characteristics. Below is the detailed layer structure:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material TFA615 0.508mm (20mil)
Copper Layer 2 Copper (1oz) 35 μm

 
 
PCB Statistics
The 2-layer TFA615 PCB is designed for high-density routing and efficient component placement, ensuring reliable performance for complex systems. Key statistics include:

  • Components: 35
  • Total Pads: 153
  • Thru Hole Pads: 121
  • Top SMT Pads: 32
  • Bottom SMT Pads: 0
  • Vias: 77
  • Nets: 2

 
 
Introduction to TFA615 Material
TFA615 is a cutting-edge PTFE ceramic composite material, designed specifically for aerospace-grade applications. Unlike traditional fiberglass-reinforced laminates, TFA615 uses nano-ceramic particles and PTFE resin, eliminating the fiberglass effect on electromagnetic wave propagation. This results in exceptional frequency stability, low dielectric loss, and minimal anisotropy.
 
The material’s balanced X/Y/Z thermal expansion coefficients ensure dimensional stability, even in extreme environments, while its high thermal conductivity aids in efficient heat dissipation.
 
 
Features of TFA615

  • Dielectric Constant (Dk): 6.15 ± 0.12 at 10GHz
  • Dissipation Factor (Df):
  • 0.0015 at 10GHz
  • 0.0017 at 20GHz
  • Thermal Conductivity: 0.8 W/mK
  • CTE (Coefficient of Thermal Expansion):
  • X-axis: 16 ppm/°C
  • Y-axis: 16 ppm/°C
  • Z-axis: 29 ppm/°C
  • Range: -55°C to 288°C
  • Moisture Absorption: 0.06%
  • Thermal Decomposition Temperature (Td): 503°C
  • UL Flammability Rating: UL 94-V0

 
 
Applications of TFA615 PCB

  1. Aerospace Equipment: Used in space, in-cabin, and aircraft systems.
  2. Microwave and Antenna Systems: Supports phase-sensitive and high-frequency antennas.
  3. Radar Systems: Ideal for early warning and airborne radar systems.
  4. Phased Array Antennas and Beamforming Networks: Enables precision in RF applications.
  5. Satellite Communications: Provides consistent dielectric performance for navigation systems.
  6. Power Amplifiers: Ensures efficient heat dissipation for high-power applications.

 
 
Why Choose the 2-Layer TFA615 PCB?
The 2-layer TFA615 PCB is the perfect choice for high-frequency and aerospace-grade applications. Its combination of advanced dielectric properties, minimal signal loss, and thermal reliability makes it a trusted solution in mission-critical systems.
 
Contact us today for more information or to place an order!
 

Empfohlene Produkte
produits
EINZELHEITEN ZU DEN PRODUKTEN
2-Layer TFA615 PCB 0.508mm Thin using PTFE ceramic composite dielectric material, Immersion Gold Finish for Power amplifiers
MOQ: 1pcs
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000pcs
Ausführliche Information
Herkunftsort
China
Markenname
Ceramic
Zertifizierung
ISO9001
Modellnummer
TFA615
Grundmaterial:
TFA615
Testmethode:
Flying Probe -Test
Kupfergewicht:
0.5-3oz
Kupfer Thinknes:
1 oz
Modell:
XCET
Seidenbildschirm:
Grün, Schwarz, Blau, Gelb, Rot usw.
Schichten:
2
Land:
China
Min -Linienbreite:
5mil
Kupfer Thk:
1oz
Oberflächenhalterung:
Ja
Produkttyp:
Gedruckte Leiterplatte
Min Bestellmenge:
1pcs
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000pcs
Beschreibung des Produkts

2-Layer TFA615 PCB: 0.6mm Thin, Immersion Gold Finish, and Aerospace-Grade High-Frequency Performance
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 
 
Overview of the 2-Layer TFA615 PCB
The 2-layer TFA615 PCB is a high-performance printed circuit board designed for aerospace, microwave, and radar applications. Manufactured using the TFA615 PTFE ceramic composite dielectric material, this PCB exhibits outstanding electrical, thermal, and mechanical properties. With a dielectric constant of 6.15, low dissipation factor, and minimal anisotropy, this material is optimized for high-frequency and high-reliability systems in demanding environments.
 
With a finished thickness of 0.6mm, immersion gold surface finish, and rigid structure, the TFA615 PCB meets IPC-Class-2 standards, making it an ideal solution for mission-critical applications in aerospace and satellite communications.
 
2-Layer TFA615 PCB 0.508mm Thin using PTFE ceramic composite dielectric material, Immersion Gold Finish for Power amplifiers 0
 
PCB Construction Details

Parameter Specification
Base Material TFA615
Layer Count 2 layers
Board Dimensions 206mm x 54mm ± 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

 
 
PCB Stackup
The 2-layer TFA615 PCB stackup is engineered for superior RF and microwave performance, utilizing TFA615 material for its low dielectric loss and stable frequency characteristics. Below is the detailed layer structure:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material TFA615 0.508mm (20mil)
Copper Layer 2 Copper (1oz) 35 μm

 
 
PCB Statistics
The 2-layer TFA615 PCB is designed for high-density routing and efficient component placement, ensuring reliable performance for complex systems. Key statistics include:

  • Components: 35
  • Total Pads: 153
  • Thru Hole Pads: 121
  • Top SMT Pads: 32
  • Bottom SMT Pads: 0
  • Vias: 77
  • Nets: 2

 
 
Introduction to TFA615 Material
TFA615 is a cutting-edge PTFE ceramic composite material, designed specifically for aerospace-grade applications. Unlike traditional fiberglass-reinforced laminates, TFA615 uses nano-ceramic particles and PTFE resin, eliminating the fiberglass effect on electromagnetic wave propagation. This results in exceptional frequency stability, low dielectric loss, and minimal anisotropy.
 
The material’s balanced X/Y/Z thermal expansion coefficients ensure dimensional stability, even in extreme environments, while its high thermal conductivity aids in efficient heat dissipation.
 
 
Features of TFA615

  • Dielectric Constant (Dk): 6.15 ± 0.12 at 10GHz
  • Dissipation Factor (Df):
  • 0.0015 at 10GHz
  • 0.0017 at 20GHz
  • Thermal Conductivity: 0.8 W/mK
  • CTE (Coefficient of Thermal Expansion):
  • X-axis: 16 ppm/°C
  • Y-axis: 16 ppm/°C
  • Z-axis: 29 ppm/°C
  • Range: -55°C to 288°C
  • Moisture Absorption: 0.06%
  • Thermal Decomposition Temperature (Td): 503°C
  • UL Flammability Rating: UL 94-V0

 
 
Applications of TFA615 PCB

  1. Aerospace Equipment: Used in space, in-cabin, and aircraft systems.
  2. Microwave and Antenna Systems: Supports phase-sensitive and high-frequency antennas.
  3. Radar Systems: Ideal for early warning and airborne radar systems.
  4. Phased Array Antennas and Beamforming Networks: Enables precision in RF applications.
  5. Satellite Communications: Provides consistent dielectric performance for navigation systems.
  6. Power Amplifiers: Ensures efficient heat dissipation for high-power applications.

 
 
Why Choose the 2-Layer TFA615 PCB?
The 2-layer TFA615 PCB is the perfect choice for high-frequency and aerospace-grade applications. Its combination of advanced dielectric properties, minimal signal loss, and thermal reliability makes it a trusted solution in mission-critical systems.
 
Contact us today for more information or to place an order!
 

Sitemap |  Datenschutzrichtlinie | China gut Qualität Bicheng neu versendete Leiterplatte Lieferant. Urheberrecht © 2016-2025 Shenzhen Bicheng Electronics Technology Co., Ltd - Alle. Alle Rechte vorbehalten.