Fabricated with TF600 DK6.0 modified PTFE/ceramic composite laminate 0.7mm (25mil) RF microwave PCB

2-Layer TF600 High-Frequency PCB – 25mil (0.7mm) with ENIG Finish & Copper-Filled Vias

Product Introduction

We present our 2-Layer TF600 PCB – a high-performance, thermosetting RF circuit board engineered for applications demanding ultra-low dielectric loss, stable Dk, and reliable thermal performance. Fabricated with TF600 modified PTFE/ceramic composite laminate and finished with ENIG (Electroless Nickel Immersion Gold) , this 0.7mm (25mil) board delivers a stable dielectric constant (Dk 6.0 ±0.15 @ 10 GHz) and low dissipation factor (Df 0.0025). The glass-fiber-free construction ensures uniform electrical properties, while copper-filled vias on designated IC pads provide enhanced thermal and electrical conductivity for power-intensive RF components.

Key Specifications

PCB Stackup (2-Layer Rigid)

PCB Statistics

Dimensions: 78 mm × 65 mm ±0.15 mm (1 piece)

Components: 43

Total Pads: 61 (32 thru-hole, 29 SMT on top, 0 on bottom)

Vias: 34

Nets: 2

Key Features of TF600

Quality Assurance

100% electrical testing prior to shipment

Copper-filled vias on designated IC pads for enhanced thermal/electrical performance

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

Typical Applications

Microwave/RF Transceivers

5G/6G Massive MIMO Antennas

Radar Systems (Automotive ADAS, Aerospace)

Satellite Communication Payloads

High-Power RF Amplifiers

Test & Measurement Equipment (Vector Network Analyzers)

Explanation of TF600 Substrate

What is TF600?

TF600 is a thermosetting high-frequency laminate composed of modified PTFE resin combined with micron-sized ceramic fillers. Unlike traditional PTFE-based RF materials (such as Rogers RT/duroid series), TF600 uses a thermoset resin system modified with PTFE, offering a unique balance of high-frequency performance and manufacturability.

Key Characteristics That Define TF600

1. Ceramic-Filled, No Glass Fiber Cloth

Most RF laminates (e.g., standard PTFE/woven-glass) use fiberglass cloth for reinforcement. TF600 contains no glass fiber cloth. Instead, it uses micron-sized ceramic particles as the filler. This eliminates glass weave effects – a common cause of Dk variation and impedance mismatch in long differential pairs or phase-sensitive circuits. The result is uniform electrical properties across the entire panel.

2. Thermosetting (Not Thermoplastic)

Traditional PTFE (e.g., RT/duroid 5870/5880) is a thermoplastic – it softens with heat and requires specialized sodium-based treatment for plating. TF600 is a thermoset – it cures permanently and does not re-soften under heat. This provides:

• Better dimensional stability during soldering
• No special pre-plating treatment (unlike PTFE)
• Compatibility with standard FR4 fabrication processes (drilling, plating, lamination)

3. High Dk (6.0) for Miniaturization

With a Dk of 6.0 ±0.15, TF600 sits in the mid-to-high Dk range (compared to ~2.2–3.5 for low-Dk RF materials). This allows:

• Circuit miniaturization – shorter wavelengths in the material mean smaller passive components (filters, couplers, antennas)
• Controlled impedance with wider trace widths (easier to manufacture)
• Effective for patch antennas and resonators

4. Ultra-Low Loss (Df 0.0025)

A dissipation factor of 0.0025 at 10 GHz is exceptionally low for a thermosetting material. This means:

• Minimal signal insertion loss
• High Q-factor for resonant structures
• Suitable for high-power RF amplifiers (less heat generated in the dielectric)

5. High Thermal Stability (Tg >280°C)

With a glass transition temperature exceeding 280°C, TF600 withstands:

• Lead-free assembly (260°C reflow)
• Multiple soldering cycles without degradation
• T260 >60 minutes and T288 >20 minutes – excellent thermal resistance for thick boards or high-power designs

6. Copper-Matched CTE

The X/Y CTE (14–16 / 12–14 ppm/°C) is well-matched to copper (~17 ppm/°C), ensuring:

• Reliable plated through-hole (PTH) integrity
• Reduced stress on solder joints during thermal cycling
• Excellent dimensional stability

7. Low Moisture Absorption (0.06%)

Unlike some PTFE materials that can absorb moisture and shift Dk, TF600's 0.06% absorption ensures stable electrical performance in humid environments – critical for outdoor radar, automotive, and satellite applications.

8. FR4-Compatible Processing – The Key Advantage

This means TF600 can be fabricated on standard FR4 production lines – reducing lead times and cost compared to exotic PTFE materials.

How TF600 Compares to Other Materials

When to Choose TF600

Choose TF600 when you need:

A stable Dk around 6.0 for circuit miniaturization

Ultra-low loss (Df 0.0025) without moving to expensive PTFE

FR4-compatible processing to reduce cost and lead time

High thermal reliability (Tg >280°C) for lead-free assembly and high-power RF

No glass weave effects – ideal for phase-sensitive arrays

Low moisture absorption for outdoor/harsh environments

Consider alternatives when:

You need Dk < 3.0 (look at RT/duroid 5870/5880 or RO3003)

You need Df < 0.0015 (look at RT/duroid 5880 or Teflon-based materials)

Your design is extremely cost-sensitive and frequencies are low (<1 GHz) – standard FR4 may suffice

Summary

TF600 is a modern, thermosetting, ceramic-filled RF laminate that bridges the gap between high-cost PTFE materials and lossy FR4. It offers stable Dk of 6.0, ultra-low loss of 0.0025, excellent thermal stability (Tg >280°C) , and – most importantly – FR4-compatible processing. The absence of glass fiber cloth eliminates Dk variation, making it ideal for 5G/6G antennas, automotive radar, satellite communications, and high-power RF amplifiers where signal integrity, miniaturization, and manufacturability are equally critical.