RO4003C 8-Layer Multilayer PCB 4 core boards 1.524mm RO4003C+1.524mm RO4003C + 0.762mm RO4003C + 0.762mm RO4003C RO4450F

8-Layer Multilayer PCB with RO4003C

This custom-engineered printed circuit board is designed for demanding high-frequency and high-speed digital applications. Featuring a robust multilayer stack-up of Rogers RO4003C laminates and RO4450F bondply, this board delivers exceptional signal integrity, thermal management, and mechanical stability.

Key Specifications

Material Advantage: RO4003C

The board utilizes RO4003C, a hydrocarbon ceramic laminate from Rogers Corporation. Unlike standard FR4, RO4003C offers:

Stable Dielectric Constant (Dk): 3.38 ± 0.05 for precise impedance control

Low Dissipation Factor (Df): 0.0027 @ 10 GHz minimizes signal loss

Excellent Thermal Conductivity: 0.71 W/m/K for efficient heat dissipation

Consistent Performance: Reliable across frequency and temperature variations

The RO4450F bondply ensures robust multilayer bonding and thermal stability throughout the stack.

Multilayer Board Fabrication Guide for RO4003C

Inner Layer Preparation

Surface Preparation: Chemical cleaning and micro-etching is recommended for thinner cores, while mechanical scrubbing is suitable for thicker laminates.

Oxide Treatment: RO4003C cores can be processed through standard copper oxide or alternative treatments to prepare for multilayer bonding.

Drilling Guidelines

Note: Drilling speeds above 500 SFM should be avoided. Expected hole wall roughness: 8-25 µm.

Plated Through-Hole (PTH) Processing

Desmear: Typically not required for double-sided boards. For multilayers, alkaline permanganate or plasma processes may be used.

Etchback: Not recommended as it may loosen filler particles.

Metallization: Compatible with standard electroless copper and direct deposition processes.

Routing Guidelines

Use carbide multi-fluted spiral routers

Remove copper from routing path to prevent burring

Maximum stack height: 70% of flute length

Applications

This 8-layer RO4003C PCB is ideal for:

Telecommunications: 5G base stations, backhaul equipment

RF/Microwave Circuits: Power amplifiers, filters, low-noise amplifiers

High-Speed Digital: SerDes channels, high-layer count backplanes

Aerospace & Defense: Radar systems, high-reliability communications