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Isola's FR408HR Multi-Layer PCBs with Immersion Gold Finish with 1oz copper per layer for RF and microwave designs

Isola's FR408HR Multi-Layer PCBs with Immersion Gold Finish with 1oz copper per layer for RF and microwave designs

MOQ: 1Stk
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Werktage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000 Stück
Ausführliche Information
Herkunftsort
China
Markenname
Isola's
Zertifizierung
ISO9001
Modellnummer
FR408HR
Min Bestellmenge:
1Stk
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Werktage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000 Stück
Beschreibung des Produkts

FR408HR Multi-Layer PCBs with Immersion Gold Finish

 

 

The FR408HR Multi-Layer PCBs are high-performance printed circuit boards designed for advanced electronic applications requiring exceptional signal integrity, thermal stability, and reliability. Built with Isola's FR408HR laminate, these PCBs offer excellent electrical and mechanical properties, making them ideal for high-speed digital, RF, and microwave designs. With 1oz copper per layer, immersion gold (ENIG) surface finish, and blue solder mask with white silkscreen, these PCBs are a robust solution for modern electronics.

 

Isola's FR408HR Multi-Layer PCBs with Immersion Gold Finish with 1oz copper per layer for RF and microwave designs 0

 

This product highlights two case studies showcasing the versatility of FR408HR material for multi-layer PCB designs.

 

Case Study 1: 6-Layer PCB

 

Specification Details
Board Type Six-layer PCB
Dimensions 79mm x 105mm (1 piece)
Lamination Thickness 1.60mm
Copper Thickness 1oz (35μm) per layer
Surface Finish Immersion Gold (ENIG)
Solder Mask Blue (top and bottom layers)
Silkscreen White lettering (top and bottom layers)
Special Structure Resin-filled holes (0.2mm-0.4mm diameter)

 

 

Case Study 2: 4-Layer PCB

Specification Details
Board Type Four-layer PCB
Dimensions 96mm x 115mm (1 piece)
Lamination Thickness 1.58mm
Copper Thickness 1oz (35μm) per layer
Surface Finish Immersion Gold (ENIG)
Solder Mask Blue (top and bottom layers)
Silkscreen White lettering (top and bottom layers)
Special Structure Blind vias (L1-L3)

 

FR408HR Typical Values Table

Property Typical Value Units Test Method
    Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 190 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) A. T260 60 Minutes 2.4.24.1
B. T288 >30
Z-Axis CTE A. Pre-Tg 55 ppm/°C 2.4.24C
B. Post-Tg 230 ppm/°C %
C. 50 to 260°C, (Total Expansion) 2.8  
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched Pass Pass Visual 2.4.13.1
B. Etched
  A. @ 100 MHz 3.72   2.5.5.3
Dk, Permittivity B. @ 1 GHz 3.69 2.5.5.9
  C. @ 2 GHz 3.68   Bereskin Stripline
  D. @ 5 GHz 3.64   Bereskin Stripline
  E. @ 10 GHz 3.65   Bereskin Stripline
  A. @ 100 MHz 0.0072   2.5.5.3
Df, Loss Tangent B. @ 1 GHz 0.0091 2.5.5.9
  C. @ 2 GHz 0.0092   Bereskin Stripline
  D. @ 5 GHz 0.0098   Bereskin Stripline
  E. @ 10 GHz 0.0095   Bereskin Stripline
Volume Resistivity A. After moisture resistance 4.4 x 107 M阝-cm 2.5.17.1
B. At elevated temperature 9.4 x 107
Surface Resistivity A. After moisture resistance 2.6 x 106 M阝 2.5.17.1
B. At elevated temperature 2.1 x 108
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 137 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 70 (1741) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A
ASTM D3638
  A. Low profile copper foil and very low profile copper foil all copper foil >17 阝m [0.669 mil] 1.14 (6.5)   2.4.8C
Peel Strength B. Standard profile copper 0.96 (5.5) N/mm (lb/inch) 2.4.8.2A 2.4.8.3
  1. After thermal stress 0.90 (5.1)    
  2. After process solutions      
Flexural Strength A. Length direction 72.5 ksi 2.4.4B
B. Cross direction 58
Tensile Strength A. Length direction 54.5 ksi ASTM D3039
B. Cross direction 38.7
Young's Modulus A. Length direction 3695 ksi ASTM D790-15e2
B. Cross direction 3315
Poisson's Ratio A. Length direction 0.137 ASTM D3039
B. Cross direction 0.133
Moisture Absorption 0.061 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796

 

Key Features of FR408HR:

Low-loss material for high-speed signal integrity.

Excellent thermal reliability for lead-free soldering.

Low moisture absorption for enhanced performance in humid environments.

High Tg and Td values for thermal stability.

CTE matching to copper, minimizing risk of delamination.

 

 

Benefits of FR408HR Multi-Layer PCBs

 

High Signal Integrity: The low DkD_kDk​ and DF ensure consistent performance for high-speed and high-frequency applications.

 

Exceptional Durability: Resin-filled holes and blind vias enhance mechanical stability and support compact, high-density designs.

 

Thermal Reliability: With a high Tg and excellent resistance to thermal stress, the PCBs maintain structural integrity during manufacturing and operation.

 

Corrosion Resistance: The ENIG surface finish protects against oxidation and ensures long-term reliability.

 

Customizability: FR408HR supports complex via structures and multi-layer configurations, allowing for tailored designs.

 

 

Applications

The FR408HR Multi-Layer PCBs are suitable for a wide range of applications, including:

Telecommunications Equipment: Routers, switches, and base stations.

Aerospace and Defense: Radar systems and avionics.

Consumer Electronics: Smartphones, tablets, and IoT devices.

High-Speed Digital Systems: Servers, data centers, and network infrastructure.

RF and Microwave Applications: Antennas, filters, and amplifiers.

 

 

Conclusion

The FR408HR Multi-Layer PCBs are engineered to deliver exceptional performance and reliability for advanced electronic systems. Whether it’s the six-layer PCB with resin-filled holes or the four-layer PCB with blind vias, these boards leverage the superior properties of FR408HR laminate to meet the demands of industries such as telecommunications, aerospace, and consumer electronics. With their robust construction, customizable designs, and high electrical performance, these PCBs are the ideal solution for applications requiring precision and durability.

 

produits
EINZELHEITEN ZU DEN PRODUKTEN
Isola's FR408HR Multi-Layer PCBs with Immersion Gold Finish with 1oz copper per layer for RF and microwave designs
MOQ: 1Stk
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Werktage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000 Stück
Ausführliche Information
Herkunftsort
China
Markenname
Isola's
Zertifizierung
ISO9001
Modellnummer
FR408HR
Min Bestellmenge:
1Stk
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Werktage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000 Stück
Beschreibung des Produkts

FR408HR Multi-Layer PCBs with Immersion Gold Finish

 

 

The FR408HR Multi-Layer PCBs are high-performance printed circuit boards designed for advanced electronic applications requiring exceptional signal integrity, thermal stability, and reliability. Built with Isola's FR408HR laminate, these PCBs offer excellent electrical and mechanical properties, making them ideal for high-speed digital, RF, and microwave designs. With 1oz copper per layer, immersion gold (ENIG) surface finish, and blue solder mask with white silkscreen, these PCBs are a robust solution for modern electronics.

 

Isola's FR408HR Multi-Layer PCBs with Immersion Gold Finish with 1oz copper per layer for RF and microwave designs 0

 

This product highlights two case studies showcasing the versatility of FR408HR material for multi-layer PCB designs.

 

Case Study 1: 6-Layer PCB

 

Specification Details
Board Type Six-layer PCB
Dimensions 79mm x 105mm (1 piece)
Lamination Thickness 1.60mm
Copper Thickness 1oz (35μm) per layer
Surface Finish Immersion Gold (ENIG)
Solder Mask Blue (top and bottom layers)
Silkscreen White lettering (top and bottom layers)
Special Structure Resin-filled holes (0.2mm-0.4mm diameter)

 

 

Case Study 2: 4-Layer PCB

Specification Details
Board Type Four-layer PCB
Dimensions 96mm x 115mm (1 piece)
Lamination Thickness 1.58mm
Copper Thickness 1oz (35μm) per layer
Surface Finish Immersion Gold (ENIG)
Solder Mask Blue (top and bottom layers)
Silkscreen White lettering (top and bottom layers)
Special Structure Blind vias (L1-L3)

 

FR408HR Typical Values Table

Property Typical Value Units Test Method
    Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 190 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) A. T260 60 Minutes 2.4.24.1
B. T288 >30
Z-Axis CTE A. Pre-Tg 55 ppm/°C 2.4.24C
B. Post-Tg 230 ppm/°C %
C. 50 to 260°C, (Total Expansion) 2.8  
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched Pass Pass Visual 2.4.13.1
B. Etched
  A. @ 100 MHz 3.72   2.5.5.3
Dk, Permittivity B. @ 1 GHz 3.69 2.5.5.9
  C. @ 2 GHz 3.68   Bereskin Stripline
  D. @ 5 GHz 3.64   Bereskin Stripline
  E. @ 10 GHz 3.65   Bereskin Stripline
  A. @ 100 MHz 0.0072   2.5.5.3
Df, Loss Tangent B. @ 1 GHz 0.0091 2.5.5.9
  C. @ 2 GHz 0.0092   Bereskin Stripline
  D. @ 5 GHz 0.0098   Bereskin Stripline
  E. @ 10 GHz 0.0095   Bereskin Stripline
Volume Resistivity A. After moisture resistance 4.4 x 107 M阝-cm 2.5.17.1
B. At elevated temperature 9.4 x 107
Surface Resistivity A. After moisture resistance 2.6 x 106 M阝 2.5.17.1
B. At elevated temperature 2.1 x 108
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 137 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 70 (1741) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A
ASTM D3638
  A. Low profile copper foil and very low profile copper foil all copper foil >17 阝m [0.669 mil] 1.14 (6.5)   2.4.8C
Peel Strength B. Standard profile copper 0.96 (5.5) N/mm (lb/inch) 2.4.8.2A 2.4.8.3
  1. After thermal stress 0.90 (5.1)    
  2. After process solutions      
Flexural Strength A. Length direction 72.5 ksi 2.4.4B
B. Cross direction 58
Tensile Strength A. Length direction 54.5 ksi ASTM D3039
B. Cross direction 38.7
Young's Modulus A. Length direction 3695 ksi ASTM D790-15e2
B. Cross direction 3315
Poisson's Ratio A. Length direction 0.137 ASTM D3039
B. Cross direction 0.133
Moisture Absorption 0.061 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796

 

Key Features of FR408HR:

Low-loss material for high-speed signal integrity.

Excellent thermal reliability for lead-free soldering.

Low moisture absorption for enhanced performance in humid environments.

High Tg and Td values for thermal stability.

CTE matching to copper, minimizing risk of delamination.

 

 

Benefits of FR408HR Multi-Layer PCBs

 

High Signal Integrity: The low DkD_kDk​ and DF ensure consistent performance for high-speed and high-frequency applications.

 

Exceptional Durability: Resin-filled holes and blind vias enhance mechanical stability and support compact, high-density designs.

 

Thermal Reliability: With a high Tg and excellent resistance to thermal stress, the PCBs maintain structural integrity during manufacturing and operation.

 

Corrosion Resistance: The ENIG surface finish protects against oxidation and ensures long-term reliability.

 

Customizability: FR408HR supports complex via structures and multi-layer configurations, allowing for tailored designs.

 

 

Applications

The FR408HR Multi-Layer PCBs are suitable for a wide range of applications, including:

Telecommunications Equipment: Routers, switches, and base stations.

Aerospace and Defense: Radar systems and avionics.

Consumer Electronics: Smartphones, tablets, and IoT devices.

High-Speed Digital Systems: Servers, data centers, and network infrastructure.

RF and Microwave Applications: Antennas, filters, and amplifiers.

 

 

Conclusion

The FR408HR Multi-Layer PCBs are engineered to deliver exceptional performance and reliability for advanced electronic systems. Whether it’s the six-layer PCB with resin-filled holes or the four-layer PCB with blind vias, these boards leverage the superior properties of FR408HR laminate to meet the demands of industries such as telecommunications, aerospace, and consumer electronics. With their robust construction, customizable designs, and high electrical performance, these PCBs are the ideal solution for applications requiring precision and durability.

 

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