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Rogers RO3206 PCB 2-layer built on 1.27mm (50mil) laminate core raw matetial with Immersion Gold 35μm (1oz) copper

Rogers RO3206 PCB 2-layer built on 1.27mm (50mil) laminate core raw matetial with Immersion Gold 35μm (1oz) copper

MOQ: 1Stk
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000 Stück
Ausführliche Information
Herkunftsort
China
Markenname
Rogers
Zertifizierung
ISO9001
Modellnummer
Rohstoffe
Min Bestellmenge:
1Stk
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000 Stück
Beschreibung des Produkts

Introducing Our 2-Layer PCB with Rogers RO3206 Core

 

We are excited to present our 2-layer PCB, built with Rogers RO3206 laminate(https://www.circuitboardpcbs.com/sale-14172261-ro3206-high-frequency-pcb-built-on-25mil-0-635mm-substrate-with-double-sided-copper-and-immersion-si.html), a high-frequency material designed to offer exceptional electrical performance and mechanical stability at a competitive price. The RO3206 laminate, part of the Rogers RO3000 series, is ideal for applications requiring low dielectric loss, rigidity, and dimensional stability, making it suitable for a wide range of RF and microwave applications.

 

Rogers RO3206 PCB 2-layer built on 1.27mm (50mil) laminate core raw matetial with Immersion Gold 35μm (1oz) copper 0

 

PCB Construction Details

This PCB is meticulously designed to meet the requirements of high-frequency and high-reliability applications. The construction details are as follows:

Parameter Specification
Base Material Rogers RO3206
Layer Count 2-layer
Board Dimensions 90.92mm x 53.03mm ± 0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 1.4mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask Green
Bottom Solder Mask None
Top Silkscreen White
Bottom Silkscreen None
Electrical Testing 100% tested prior to shipment
Accepted Standard IPC-Class-2

 

 

PCB Stackup

The RO3206 core, with its 50mil thickness (1.27mm), provides superior mechanical stability and low dielectric loss for high-frequency applications. The stackup for this 2-layer PCB design is as follows:

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm (1oz)
Core Material Rogers RO3206 Core 1.27mm (50mil)
Copper Layer 2 Copper Foil 35μm (1oz)

 

 

PCB Statistics

This PCB is optimized for compact, high-performance designs with the following specifications:

Parameter Value
Components 36
Total Pads 59
Thru Hole Pads 27
Top SMT Pads 32
Bottom SMT Pads 0
Vias 33
Nets 2
Supplied Artwork Gerber RS-274-X

 

 

About Rogers RO3206 Material

The Rogers RO3206 laminate is a ceramic-filled PTFE composite reinforced with woven fiberglass, offering low dielectric loss and high mechanical stability. It is engineered to maintain uniform electrical and mechanical performance, making it a preferred choice for high-frequency and RF applications.

 

 

Key Features of RO3206:

  • Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C, providing consistent performance across frequencies.
  • Dissipation Factor (Df): 0.0027 at 10 GHz, ensuring minimal signal loss.
  • Thermal Conductivity: 0.67 W/mK, offering excellent heat dissipation.
  • Moisture Absorption: <0.1%, ensuring stable performance in humid conditions.
  • Coefficient of Thermal Expansion (CTE): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C.Z-axis: 34 ppm/°C.
  • Copper Peel Strength: 10.7 lbs/in, ensuring reliable adhesion and durability.

The woven fiberglass reinforcement improves rigidity, making the material easy to handle and ensuring dimensional stability during production.

 

 

 

Applications

This PCB, constructed with Rogers RO3206, is ideal for a wide range of RF and microwave applications, including:

  1. Automotive Collision Avoidance Systems 
  2. Automotive GPS Antennas 
  3. Wireless Telecommunications Systems 
  4. Microstrip Patch Antennas 
  5. Direct Broadcast Satellites 
  6. Datalink on Cable Systems 
  7. Remote Meter Readers 
  8. Power Backplanes 
  9. LMDS and Wireless Broadband 
  10. Base Station Infrastructure 

 

 

Conclusion

The 2-layer PCB with Rogers RO3206 core is a cost-effective, high-performance solution for RF and microwave applications requiring low loss, dimensional stability, and thermal reliability. With its advanced material properties and precise construction, this PCB is ideal for industries such as automotive, telecommunications, aerospace, and defense.

 

Contact us today to learn more or request a quote. We are committed to delivering high-quality PCBs that meet your exact requirements!

 

produits
EINZELHEITEN ZU DEN PRODUKTEN
Rogers RO3206 PCB 2-layer built on 1.27mm (50mil) laminate core raw matetial with Immersion Gold 35μm (1oz) copper
MOQ: 1Stk
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000 Stück
Ausführliche Information
Herkunftsort
China
Markenname
Rogers
Zertifizierung
ISO9001
Modellnummer
Rohstoffe
Min Bestellmenge:
1Stk
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000 Stück
Beschreibung des Produkts

Introducing Our 2-Layer PCB with Rogers RO3206 Core

 

We are excited to present our 2-layer PCB, built with Rogers RO3206 laminate(https://www.circuitboardpcbs.com/sale-14172261-ro3206-high-frequency-pcb-built-on-25mil-0-635mm-substrate-with-double-sided-copper-and-immersion-si.html), a high-frequency material designed to offer exceptional electrical performance and mechanical stability at a competitive price. The RO3206 laminate, part of the Rogers RO3000 series, is ideal for applications requiring low dielectric loss, rigidity, and dimensional stability, making it suitable for a wide range of RF and microwave applications.

 

Rogers RO3206 PCB 2-layer built on 1.27mm (50mil) laminate core raw matetial with Immersion Gold 35μm (1oz) copper 0

 

PCB Construction Details

This PCB is meticulously designed to meet the requirements of high-frequency and high-reliability applications. The construction details are as follows:

Parameter Specification
Base Material Rogers RO3206
Layer Count 2-layer
Board Dimensions 90.92mm x 53.03mm ± 0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 1.4mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask Green
Bottom Solder Mask None
Top Silkscreen White
Bottom Silkscreen None
Electrical Testing 100% tested prior to shipment
Accepted Standard IPC-Class-2

 

 

PCB Stackup

The RO3206 core, with its 50mil thickness (1.27mm), provides superior mechanical stability and low dielectric loss for high-frequency applications. The stackup for this 2-layer PCB design is as follows:

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm (1oz)
Core Material Rogers RO3206 Core 1.27mm (50mil)
Copper Layer 2 Copper Foil 35μm (1oz)

 

 

PCB Statistics

This PCB is optimized for compact, high-performance designs with the following specifications:

Parameter Value
Components 36
Total Pads 59
Thru Hole Pads 27
Top SMT Pads 32
Bottom SMT Pads 0
Vias 33
Nets 2
Supplied Artwork Gerber RS-274-X

 

 

About Rogers RO3206 Material

The Rogers RO3206 laminate is a ceramic-filled PTFE composite reinforced with woven fiberglass, offering low dielectric loss and high mechanical stability. It is engineered to maintain uniform electrical and mechanical performance, making it a preferred choice for high-frequency and RF applications.

 

 

Key Features of RO3206:

  • Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C, providing consistent performance across frequencies.
  • Dissipation Factor (Df): 0.0027 at 10 GHz, ensuring minimal signal loss.
  • Thermal Conductivity: 0.67 W/mK, offering excellent heat dissipation.
  • Moisture Absorption: <0.1%, ensuring stable performance in humid conditions.
  • Coefficient of Thermal Expansion (CTE): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C.Z-axis: 34 ppm/°C.
  • Copper Peel Strength: 10.7 lbs/in, ensuring reliable adhesion and durability.

The woven fiberglass reinforcement improves rigidity, making the material easy to handle and ensuring dimensional stability during production.

 

 

 

Applications

This PCB, constructed with Rogers RO3206, is ideal for a wide range of RF and microwave applications, including:

  1. Automotive Collision Avoidance Systems 
  2. Automotive GPS Antennas 
  3. Wireless Telecommunications Systems 
  4. Microstrip Patch Antennas 
  5. Direct Broadcast Satellites 
  6. Datalink on Cable Systems 
  7. Remote Meter Readers 
  8. Power Backplanes 
  9. LMDS and Wireless Broadband 
  10. Base Station Infrastructure 

 

 

Conclusion

The 2-layer PCB with Rogers RO3206 core is a cost-effective, high-performance solution for RF and microwave applications requiring low loss, dimensional stability, and thermal reliability. With its advanced material properties and precise construction, this PCB is ideal for industries such as automotive, telecommunications, aerospace, and defense.

 

Contact us today to learn more or request a quote. We are committed to delivering high-quality PCBs that meet your exact requirements!

 

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