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F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems

F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems

MOQ: 1Stk
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 10000 Stück
Ausführliche Information
Herkunftsort
China
Markenname
Wangling
Zertifizierung
ISO9001
Modellnummer
F4BMS220
Min Bestellmenge:
1Stk
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
10000 Stück
Beschreibung des Produkts

Double-Sided PCB with F4BM220 Core

 

We are excited to unveil our double-sided PCB, designed with the high-performance F4BM220 laminate. This PCB is engineered for microwave, RF, and radar systems, offering exceptional electrical properties, low loss, and dimensional stability. Below, we provide a detailed breakdown of its construction, features, and applications.

 

F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems 0

 

PCB Construction Details

Parameter Specification
Base Material F4BM220
Layer Count 2-layer (double-sided)
Board Dimensions 51mm x 67mm ± 0.15mm
Minimum Trace/Space 5/8 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Testing 100% tested prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm
Core Material F4BM220 Core 0.5mm
Copper Layer 2 Copper Foil 35μm

 

 

PCB Statistics

This PCB is optimized for small-scale, high-performance designs with the following specifications:

Parameter Value
Components 5
Total Pads 19
Thru Hole Pads 11
Top SMT Pads 8
Bottom SMT Pads 0
Vias 17
Nets 2
Supplied Artwork Gerber RS-274-X

 

 

About F4BM220 Material

The F4BM220 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It is designed for microwave and RF applications requiring low dielectric loss, high insulation resistance, and excellent stability.

 

Key Features of F4BM220:

  • Dielectric Constant (Dk): 2.2 ± 0.04 at 10GHz.
  • Dissipation Factor (Df): 0.001 at 10GHz, ensuring minimal signal loss.
  • Thermal Coefficient of Dk: -142 ppm/°C (from -55°C to 150°C).
  • Coefficient of Thermal Expansion (CTE): X-axis: 25 ppm/°C. Y-axis: 34 ppm/°C. Z-axis: 240 ppm/°C.
  • Moisture Absorption: ≤ 0.08%.
  • Flammability: UL-94 V0 rated.

The F4BM220 material offers excellent dimensional stability by balancing the ratio of PTFE and fiberglass cloth, resulting in precise control of the dielectric constant and reduced thermal expansion.

 

 

Applications

Microwave and RF Systems

Phase-Sensitive Antennas and Arrays

Power Dividers, Couplers, and Combiners

Base Station Antennas

Satellite Communications

 

 

Conclusion

The double-sided PCB with F4BM220 core is a high-performance, cost-effective solution for microwave, RF, and radar systems. With its low dielectric loss, dimensional stability, and excellent thermal properties, this PCB delivers exceptional performance for high-frequency applications in industries such as telecommunications, aerospace, and defense.

 

Contact us today to learn more or to place an order. We are committed to providing high-quality PCBs that meet your specific requirements!

 

produits
EINZELHEITEN ZU DEN PRODUKTEN
F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems
MOQ: 1Stk
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 10000 Stück
Ausführliche Information
Herkunftsort
China
Markenname
Wangling
Zertifizierung
ISO9001
Modellnummer
F4BMS220
Min Bestellmenge:
1Stk
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
10000 Stück
Beschreibung des Produkts

Double-Sided PCB with F4BM220 Core

 

We are excited to unveil our double-sided PCB, designed with the high-performance F4BM220 laminate. This PCB is engineered for microwave, RF, and radar systems, offering exceptional electrical properties, low loss, and dimensional stability. Below, we provide a detailed breakdown of its construction, features, and applications.

 

F4BM220 DK2.2 PCB 2-layer 0.5mm Thick with Immersion Gold 35um copper weight using in Microwave, RF, and radar systems 0

 

PCB Construction Details

Parameter Specification
Base Material F4BM220
Layer Count 2-layer (double-sided)
Board Dimensions 51mm x 67mm ± 0.15mm
Minimum Trace/Space 5/8 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Testing 100% tested prior to shipment
Quality Standard IPC-Class-2

 

 

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper Foil 35μm
Core Material F4BM220 Core 0.5mm
Copper Layer 2 Copper Foil 35μm

 

 

PCB Statistics

This PCB is optimized for small-scale, high-performance designs with the following specifications:

Parameter Value
Components 5
Total Pads 19
Thru Hole Pads 11
Top SMT Pads 8
Bottom SMT Pads 0
Vias 17
Nets 2
Supplied Artwork Gerber RS-274-X

 

 

About F4BM220 Material

The F4BM220 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It is designed for microwave and RF applications requiring low dielectric loss, high insulation resistance, and excellent stability.

 

Key Features of F4BM220:

  • Dielectric Constant (Dk): 2.2 ± 0.04 at 10GHz.
  • Dissipation Factor (Df): 0.001 at 10GHz, ensuring minimal signal loss.
  • Thermal Coefficient of Dk: -142 ppm/°C (from -55°C to 150°C).
  • Coefficient of Thermal Expansion (CTE): X-axis: 25 ppm/°C. Y-axis: 34 ppm/°C. Z-axis: 240 ppm/°C.
  • Moisture Absorption: ≤ 0.08%.
  • Flammability: UL-94 V0 rated.

The F4BM220 material offers excellent dimensional stability by balancing the ratio of PTFE and fiberglass cloth, resulting in precise control of the dielectric constant and reduced thermal expansion.

 

 

Applications

Microwave and RF Systems

Phase-Sensitive Antennas and Arrays

Power Dividers, Couplers, and Combiners

Base Station Antennas

Satellite Communications

 

 

Conclusion

The double-sided PCB with F4BM220 core is a high-performance, cost-effective solution for microwave, RF, and radar systems. With its low dielectric loss, dimensional stability, and excellent thermal properties, this PCB delivers exceptional performance for high-frequency applications in industries such as telecommunications, aerospace, and defense.

 

Contact us today to learn more or to place an order. We are committed to providing high-quality PCBs that meet your specific requirements!

 

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