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Unleash the Power of Rogers RO3006 for Your Next RF Design

In the rapidly evolving world of high-frequency electronics, the choice of PCB material can make or break the performance of your RF designs. One material that has consistently proven its worth is the Rogers RO3006 laminate – a ceramic-filled PTFE composite that offers exceptional electrical and mechanical stability.

Let's dive into the technical details and explore how RO3006 can elevate your next RF project.

Robust Construction and Precise Specifications
This 2-layer rigid PCB features the Rogers RO3006 core material with the following key specifications:

1. Board dimensions: 45.2mm x 43.5mm
2. Minimum trace/space: 5/5 mils
3. Minimum hole size: 0.2mm
4. Finished board thickness: 0.3mm
5. Copper weight: 1oz (1.4 mils) on the outer layers
6. Via plating thickness: 20μm
7. Surface finish: Immersion Gold
8. Top silkscreen: White

The 2-layer stackup consists of the RO3006 core material with 35μm copper layers, providing a solid foundation for high-frequency circuits.

Exceptional Electrical Performance
The RO3006 material is specifically designed for microwave and RF applications, with the following standout electrical characteristics:

• Stable dielectric constant (Dk) of 6.15 ± 0.15 at 10GHz and 23°C
• Low dissipation factor of 0.002 at 10GHz and 23°C
• Thermal decomposition temperature (Td) greater than 500°C
• Moisture absorption of just 0.02%

These properties ensure precise impedance control, minimal signal integrity issues, and consistent performance across a wide range of temperatures and frequencies.

Thermal and Mechanical Reliability
In addition to its electrical prowess, RO3006 also boasts impressive thermal and mechanical properties:

Coefficient of Thermal Expansion (CTE):

• X-axis: 17 ppm/°C
• Y-axis: 17 ppm/°C
• Z-axis: 24 ppm/°C (-55°C to 288°C)
• Thermal conductivity: 0.79 W/mK

This combination of low CTE and high thermal conductivity ensures your high-frequency circuits can withstand the rigors of manufacturing and operate reliably in demanding environments.

Versatile Applications
With its exceptional RF performance and robust construction, RO3006 is well-suited for a variety of high-frequency applications, including:

• Automotive radar
• GPS antennas
• Cellular telecommunications systems
• Patch antennas for wireless communications
• Direct broadcast satellites
• Power backplanes

By leveraging the capabilities of RO3006, engineers can push the boundaries of size, weight, and power optimization while maintaining the integrity of their designs.

To learn more about how RO3006 can benefit your next RF project, don't hesitate to reach out to our team of technical experts. We're here to help you harness the power of this innovative PCB material.