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TLY-3 double-side laminate with Gold over silver finish using in Automotive radar
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TLY-3 double-side laminate with Gold over silver finish using in Automotive radar
  • Name
  • Name
  • Name

TLY-3 double-side laminate with Gold over silver finish using in Automotive radar

MOQ: 1pcs
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000pcs
Ausführliche Information
Beschreibung des Produkts
Ausführliche Information
Herkunftsort
CHINA
Markenname
Taconic
Zertifizierung
ISO9001
Modellnummer
TLY-3
Min Bestellmenge:
1pcs
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000pcs
Beschreibung des Produkts

TLY-3 2-Layer PCB: 20mil with Silver Gold Finish

 

 

The TLY-3 2-layer PCB is a high-performance circuit board designed for high-frequency RF and microwave applications. Featuring TLY-3 laminates, this PCB provides dimensional stability, low dielectric loss, and high peel strength, making it ideal for automotive radar, satellite communications, and phased array antennas. The Silver Gold finish (gold over silver) ensures superior solderability and signal integrity, providing reliability for millimeter-wave frequency designs.

 

TLY-3 double-side laminate with Gold over silver finish using in Automotive radar 0

 

Key Construction Details

Parameter Specification
Base Material TLY-3
Layer Count 2-layer (double-sided)
Board Dimensions 125mm x 47mm (± 0.15mm)
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 0.6mm
Copper Weight 1oz (35μm) on both layers
Via Plating Thickness 20μm
Surface Finish Silver plate / Gold plate (Gold over Silver)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

 

 

Features of TLY-3 Material

  • Dielectric Constant (Dk): 2.33 ± 0.02 at 10GHz, ensuring stable signal propagation.
  • Dissipation Factor (Df): 0.0012 at 10GHz for minimal signal loss.
  • Thermal Conductivity: 0.22 W/mK for efficient heat dissipation.
  • CTE (Coefficient of Thermal Expansion): X-axis: 26 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 217 ppm/°C
  • Peel Strength: 17 lbs/in for 1oz copper cladding.
  • Moisture Absorption: 0.02%, ensuring reliability in humid environments.
  • Flammability Rating: UL 94 V-0 for safety in high-risk applications.
  • Outgassing: Low outgassing characteristics (TML: 0.01%, CVCM: 0.01%) for aerospace and space applications.

 

 

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

Applications of TLY-3 PCB

Automotive Radar Systems

Satellite and Cellular Communications

Power Amplifiers

Low Noise Block Converters (LNBs), Low Noise Amplifiers (LNAs), and Low Noise Combiners (LNCs)

Aerospace Applications

Ka, E, and W Band Applications

Filters and Couplers

Phased Array Antennas

 

 

Why Choose TLY-3 PCB?

Superior High-Frequency Performance: The low Dk (2.33 ± 0.02) and low Df (0.0012) ensure minimal signal loss and stable performance at millimeter-wave frequencies.

Reliable in Harsh Environments: High peel strength, low moisture absorption, and low outgassing make it ideal for aerospace, automotive, and outdoor systems.

Ease of Manufacturing: The woven fiberglass matrix provides dimensional stability, enabling high manufacturing yields.

Environmentally Friendly: The PCB meets UL 94 V-0 flammability standards and exhibits low outgassing, ensuring sustainability and safety.

 

 

The TLY-3 2-layer PCB is the perfect solution for RF and microwave engineers seeking low-loss, high-reliability materials for advanced communication and radar systems.

Stichworte: 

Hochgeschwindigkeits-PWB,  

Hochfrequenzschaltplan,  

bluetooth circuit board

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produits
EINZELHEITEN ZU DEN PRODUKTEN
Produits

Bicheng neu versendete Leiterplatte

Rogers PWB-Brett

Takonisches PWB-Brett

PTFE PWB-Brett

flexible gedruckte Schaltung

Mehrschichtiges PWB-Brett

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TLY-3 double-side laminate with Gold over silver finish using in Automotive radar
  • Name
  • Name
  • Name
TLY-3 double-side laminate with Gold over silver finish using in Automotive radar
MOQ: 1pcs
Preis: 0.99-99USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000pcs
Ausführliche Information
Beschreibung des Produkts
Ausführliche Information
Herkunftsort
CHINA
Markenname
Taconic
Zertifizierung
ISO9001
Modellnummer
TLY-3
Min Bestellmenge:
1pcs
Preis:
0.99-99USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000pcs
Beschreibung des Produkts

TLY-3 2-Layer PCB: 20mil with Silver Gold Finish

 

 

The TLY-3 2-layer PCB is a high-performance circuit board designed for high-frequency RF and microwave applications. Featuring TLY-3 laminates, this PCB provides dimensional stability, low dielectric loss, and high peel strength, making it ideal for automotive radar, satellite communications, and phased array antennas. The Silver Gold finish (gold over silver) ensures superior solderability and signal integrity, providing reliability for millimeter-wave frequency designs.

 

TLY-3 double-side laminate with Gold over silver finish using in Automotive radar 0

 

Key Construction Details

Parameter Specification
Base Material TLY-3
Layer Count 2-layer (double-sided)
Board Dimensions 125mm x 47mm (± 0.15mm)
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 0.6mm
Copper Weight 1oz (35μm) on both layers
Via Plating Thickness 20μm
Surface Finish Silver plate / Gold plate (Gold over Silver)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

 

 

Features of TLY-3 Material

  • Dielectric Constant (Dk): 2.33 ± 0.02 at 10GHz, ensuring stable signal propagation.
  • Dissipation Factor (Df): 0.0012 at 10GHz for minimal signal loss.
  • Thermal Conductivity: 0.22 W/mK for efficient heat dissipation.
  • CTE (Coefficient of Thermal Expansion): X-axis: 26 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 217 ppm/°C
  • Peel Strength: 17 lbs/in for 1oz copper cladding.
  • Moisture Absorption: 0.02%, ensuring reliability in humid environments.
  • Flammability Rating: UL 94 V-0 for safety in high-risk applications.
  • Outgassing: Low outgassing characteristics (TML: 0.01%, CVCM: 0.01%) for aerospace and space applications.

 

 

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

Applications of TLY-3 PCB

Automotive Radar Systems

Satellite and Cellular Communications

Power Amplifiers

Low Noise Block Converters (LNBs), Low Noise Amplifiers (LNAs), and Low Noise Combiners (LNCs)

Aerospace Applications

Ka, E, and W Band Applications

Filters and Couplers

Phased Array Antennas

 

 

Why Choose TLY-3 PCB?

Superior High-Frequency Performance: The low Dk (2.33 ± 0.02) and low Df (0.0012) ensure minimal signal loss and stable performance at millimeter-wave frequencies.

Reliable in Harsh Environments: High peel strength, low moisture absorption, and low outgassing make it ideal for aerospace, automotive, and outdoor systems.

Ease of Manufacturing: The woven fiberglass matrix provides dimensional stability, enabling high manufacturing yields.

Environmentally Friendly: The PCB meets UL 94 V-0 flammability standards and exhibits low outgassing, ensuring sustainability and safety.

 

 

The TLY-3 2-layer PCB is the perfect solution for RF and microwave engineers seeking low-loss, high-reliability materials for advanced communication and radar systems.

Stichworte: 

Hochgeschwindigkeits-PWB,

Hochfrequenzschaltplan,

bluetooth circuit board

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Stadt, Baoan-Bezirk, Shenzhen-Stadt, Provinz Guangdong, China
Tel.: 86-755-27374847
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