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TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold

MOQ: 1pcs
Preis: 7USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000pcs
Ausführliche Information
Herkunftsort
CHINA
Markenname
AGC
Zertifizierung
ISO9001
Modellnummer
TSM-DS3-PCB
Min Bestellmenge:
1pcs
Preis:
7USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000pcs
Beschreibung des Produkts

What circuit boards do we do? (51)

TMS-DS3 High Frequency PCB

 

Introduction

TSM-DS3 is a dimensionally stable laminate with exceptional low-loss properties. Its thermal stability makes it an industry-leading choice, with a dissipation factor (DF) of 0.0011 at 10 GHz. This laminate offers the reliability and consistency of top-quality fiberglass reinforced epoxies.

 

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 0

 

Features

TSM-DS3 stands out as a ceramic-filled reinforced material with a minimal fiberglass content of approximately 5%. This composition allows it to compete with epoxies in the fabrication of complex multilayers, even in large formats. It was specifically developed for high-power applications, where efficient heat dissipation is crucial (thermal conductivity: 0.65 W/m*K). TSM-DS3 effectively conducts heat away from other heat sources in a PCB design.

 

Furthermore, TSM-DS3 exhibits very low coefficients of thermal expansion, making it suitable for demanding thermal cycling requirements.

 

 

PCB Capability

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 1

Our capabilities include single-sided, double-sided, multi-layer PCBs, as well as hybrid PCBs. You have the flexibility to choose the appropriate copper weight for your requirements, whether it's 1oz (35µm) or 2oz (70µm).

 

Additionally, we can accommodate various dielectric thicknesses, ranging from 5mil to 90mil, including options such as 10mil, 20mil, 30mil, 60mil and more.

 

Our capabilities extend to dimension sizes up to 400mm X 500mm, ensuring we can handle projects of different scales. To suit your aesthetic and functional preferences, we offer a diverse range of solder mask colors, including green, black, blue, yellow, red, and more.

 

Moreover, we provide various surface finish options including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold etc.

 

 

Applications

TSM-DS3 PCB covers a multitude of applications, including couplers, phased array antennas, radar manifolds, mmWave antennas, oil drilling, semiconductor, and automated test equipment (ATE) testing.

 

Thank you. I’ll see you next time.

Empfohlene Produkte
produits
EINZELHEITEN ZU DEN PRODUKTEN
TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold
MOQ: 1pcs
Preis: 7USD/PCS
Standardverpackung: Verpackung
Lieferfrist: 2-10 Arbeitstage
Zahlungsmethode: T/T, Paypal
Lieferkapazität: 50000pcs
Ausführliche Information
Herkunftsort
CHINA
Markenname
AGC
Zertifizierung
ISO9001
Modellnummer
TSM-DS3-PCB
Min Bestellmenge:
1pcs
Preis:
7USD/PCS
Verpackung Informationen:
Verpackung
Lieferzeit:
2-10 Arbeitstage
Zahlungsbedingungen:
T/T, Paypal
Versorgungsmaterial-Fähigkeit:
50000pcs
Beschreibung des Produkts

What circuit boards do we do? (51)

TMS-DS3 High Frequency PCB

 

Introduction

TSM-DS3 is a dimensionally stable laminate with exceptional low-loss properties. Its thermal stability makes it an industry-leading choice, with a dissipation factor (DF) of 0.0011 at 10 GHz. This laminate offers the reliability and consistency of top-quality fiberglass reinforced epoxies.

 

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 0

 

Features

TSM-DS3 stands out as a ceramic-filled reinforced material with a minimal fiberglass content of approximately 5%. This composition allows it to compete with epoxies in the fabrication of complex multilayers, even in large formats. It was specifically developed for high-power applications, where efficient heat dissipation is crucial (thermal conductivity: 0.65 W/m*K). TSM-DS3 effectively conducts heat away from other heat sources in a PCB design.

 

Furthermore, TSM-DS3 exhibits very low coefficients of thermal expansion, making it suitable for demanding thermal cycling requirements.

 

 

PCB Capability

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 1

Our capabilities include single-sided, double-sided, multi-layer PCBs, as well as hybrid PCBs. You have the flexibility to choose the appropriate copper weight for your requirements, whether it's 1oz (35µm) or 2oz (70µm).

 

Additionally, we can accommodate various dielectric thicknesses, ranging from 5mil to 90mil, including options such as 10mil, 20mil, 30mil, 60mil and more.

 

Our capabilities extend to dimension sizes up to 400mm X 500mm, ensuring we can handle projects of different scales. To suit your aesthetic and functional preferences, we offer a diverse range of solder mask colors, including green, black, blue, yellow, red, and more.

 

Moreover, we provide various surface finish options including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold etc.

 

 

Applications

TSM-DS3 PCB covers a multitude of applications, including couplers, phased array antennas, radar manifolds, mmWave antennas, oil drilling, semiconductor, and automated test equipment (ATE) testing.

 

Thank you. I’ll see you next time.

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